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TCM809/TCM810
3-Pin Microcontroller Reset Monitors
Features
* Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V Nominal System Voltage Supplies * 140 msec Minimum RESET Time-Out Period * RESET Output to VDD = 1.0V (TCM809) * Low Supply Current, 9 A (typ.) * VDD Transient Immunity * Small 3-Pin SC-70 and SOT-23B Packages * No External Components * Push-Pull RESET Output * Temperature Ranges: - Industrial: SC-70 (E): -40C to +85C - Extended: SOT-23, SC-70 (V): -40C to +125C
General Description
The TCM809 and TCM810 are cost-effective system supervisor circuits designed to monitor VDD in digital systems; providing a reset signal to the host processor, when necessary. No external components are required. The RESET output is typically driven active within 65 sec of VDD falling through the reset voltage threshold. RESET is maintained active for a minimum of 140 msec after VDD rises above the reset threshold. The TCM810 has an active-high RESET output, while the TCM809 has an active-low RESET output. The output of the TCM809/TCM810 is valid down to VDD = 1V. Both devices are available in 3-Pin SC-70 and SOT-23B packages. The TCM809/TCM810 are optimized to reject fast transient glitches on the VDD line. A low supply current of 9 A (typ., VDD = 3.3V) make these devices suitable for battery-powered applications.
Applications
* * * * * Computers Embedded Systems Battery-powered Equipment Critical Microcontroller Power Supply Monitoring Automotive
Pin Configurations
SOT-23B/SC-70
Typical Application Circuit
TCM809/ TCM810 VDD 3 VDD VDD PICmicro(R) Microcontroller 2 RESET INPUT (Active-Low) GND TCM809 RESET TCM810 (RESET) 2 GND 1 3 VDD
TCM809
RESET GND 1
Note: 3-Pin SOT-23B is equivalent to JEDEC TO-236.
(c) 2005 Microchip Technology Inc.
DS21661D-page 1
TCM809/TCM810
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Supply Voltage (VDD to GND) ........................................................6.0V RESET, RESET ................................................... -0.3V to (VDD +0.3V) Input Current, VDD .......................................................................20 mA Output Current, RESET, RESET.................................................20 mA dV/dt (VDD)........................................................................... 100V/sec Operating Temperature Range ...................................-40C to +125C Power Dissipation (TA = 70C): 3-Pin SOT-23B (derate 4 mW/C above +70C) ....................320 mW 3-Pin SC-70 (derate 2.17 mW/C above +70C)....................174 mW Storage Temperature Range .......................................-65C to +150C Maximum Junction Temperature, TJ............................................ 150C
ELECTRICAL CHARACTERISTICS
VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25C, VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1). Parameter VDD Range Supply Current Reset Threshold (Note 2) ICC VTH Sym Min 1.0 1.2 -- -- 4.56 4.50 4.31 4.25 3.93 3.89 3.04 3.00 2.89 2.85 2.59 2.55 2.28 2.25 Reset Threshold Tempco VDD to Reset Delay, Reset Active Time Out Period RESET Output Voltage Low (TCM809) VOL -- -- 140 -- -- -- RESET Output Voltage High (TCM809) RESET Output Voltage Low (TCM810) RESET Output Voltage High (TCM810) VOH VOL VOH 0.8 VDD VDD - 1.5 -- -- 0.8 VDD Typ -- -- 12 9 4.63 -- 4.38 -- 4.00 -- 3.08 -- 2.93 -- 2.63 -- 2.32 -- 30 65 320 -- -- -- -- -- -- -- -- Max 5.5 5.5 30 25 4.70 4.75 4.45 4.50 4.06 4.10 3.11 3.15 2.96 3.00 2.66 2.70 2.35 2.38 -- -- 560 0.3 0.4 0.3 -- -- 0.3 0.4 -- V V V V V V V V V V V V V V V ppm/C sec msec V TCM809R/S/T/Z: TCM809L/M/J: VDD = VTH min, ISINK = 1.2 mA VDD = VTH min, ISINK = 3.2 mA VDD = VTH to (VTH - 100 mV) (Note 2) TCM8xxZ: TCM8xxR: TCM8xxS: TCM8xxT: TCM809J: TCM8xxM: V A Units V Test Conditions TA = 0C to +70C TA = - 40C to +125C TCM8xxL/M/J: TCM8xxR/S/T/Z: TCM8xxL: VDD < 5.5V VDD < 3.6V TA = +25C TA = - 40C to +125C TA = +25C TA = - 40C to +125C TA = +25C TA = - 40C to +125C TA = +25C TA = - 40C to +125C TA = +25C TA = - 40C to +125C TA = +25C TA = - 40C to +125C TA = +25C TA = - 40C to +125C
VDD > 1.0V, ISINK = 50 A TCM809R/S/T/Z: VDD > VTH max, ISOURCE = 500 A TCM809L/M/J: VDD > VTH max, ISOURCE = 800 A TCM810R/S/T/Z:VDD = VTH max, ISINK = 1.2 mA TCM810L/M: VDD = VTH max, ISINK = 3.2 mA 1.8 < VDD < VTH min, ISOURCE = 150 A
Note 1: Production testing done at TA = +25C, overtemperature limits ensured by QC screen. 2: RESET output for TCM809, RESET output for TCM810.
DS21661D-page 2
(c) 2005 Microchip Technology Inc.
TCM809/TCM810
2.0
Note:
TYPICAL PERFORMANCE CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
18 TCM8xx/R/S/T/Z, No Load 16 14 12 10 VDD = 3V 8 6 4 2 0 -40 -20 0 20 40 60 80 100 120 0 -40 -20 0 20 40 60 Temperature (C) 80 100 120 VDD = 1V Power-up Reset Timeout (sec) Supply Current ( A) 350 300 250 200 150 100 50 VDD = 5V 450 400
Temperature (C)
FIGURE 2-1: Temperature.
16 TCM8xx/L/M/J, No Load 14 12 Supply Current ( A) 10
Supply Current vs.
FIGURE 2-3: vs. Temperature.
1.001
Power-up Reset Time Out
VDD = 5V Normalized Reset Threshold 1
VDD = 3V 8 6 4 2 0 -40 -20 0 20 40 60 80 100 120 VDD = 1V
0.999
0.998
0.997 -40 -20 0 20 40 60 80 100 120
Temperature (C)
Temperature (C)
FIGURE 2-2: Temperature.
Supply Current vs.
FIGURE 2-4: Normalized Reset Threshold vs. Temperature.
(c) 2005 Microchip Technology Inc.
DS21661D-page 3
TCM809/TCM810
3.0 PIN DESCRIPTIONS
The descriptions of the pins are given in Table 3-1.
TABLE 3-1:
NAME GND
PIN FUNCTION TABLE
FUNCTION Ground
RESET (TCM809) RESET push-pull output RESET (TCM810) RESET push-pull output VDD Supply voltage (+2.5V, +3.0V, +3.3V, +5.0V).
3.1
Ground (GND)
Ground terminal.
3.2
RESET Output (TCM809)
The RESET push-pull output remains low while VDD is below the reset voltage threshold, and for 240 msec (140 msec min.) after VDD rises above reset threshold.
3.3
RESET Output (TCM810)
The RESET push-pull output remains high while VDD is below the reset voltage threshold, and for 240 msec (140 msec min.) after VDD rises above reset threshold.
3.4
Supply Voltage (VDD)
VDD: +2.5V, +3.0V, +3.3V and +5.0V
DS21661D-page 4
(c) 2005 Microchip Technology Inc.
TCM809/TCM810
4.0
4.1
APPLICATIONS INFORMATION
VDD Transient Rejection
Combinations above the curve are detected as a brown-out or power-down condition. Transient immunity can be improved by adding a capacitor in close proximity to the VDD pin of the TCM809/TCM810.
The TCM809/TCM810 provides accurate VDD monitoring and reset timing during power-up, power-down and brown-out/sag conditions. These devices also reject negative-going transients (glitches) on the power supply line. Figure 4-1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive that lies under the curve will not generate a reset signal.
VDD VTH Overdrive
4.2
RESET Signal Integrity During Power-Down
Duration Maximum Transient Duration (sec) 400 320 240 160 TCM8XXL/M/J (SOT-23) 80 0
TCM8XXZ/R/S/T (SOT-23)
TA = +25C
The TCM809 RESET output is valid to VDD = 1.0V. Below this voltage the output becomes an "open circuit" and does not sink current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where RESET must be maintained valid to VDD = 0V, a pull-down resistor must be connected from RESET to ground to discharge stray capacitances and hold the output low (Figure 4-2). This resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation (100 k will be suitable for most applications). Similarly, a pull-up resistor to VDD is required for the TCM810 to ensure a valid high RESET for VDD below 1.0V. VDD
VDD TCM809 RESET R1 100 k
1 5 1000 100 Reset Comparator Overdrive [VTH - VDD] (mv)
GND
130
VDD to Reset Delay (sec)
120 110 100 90 80 70 60 50 40 30 1 10 100 1000
TCM8XXZ/R/S/T (SC-70) TCM8XXL/M/J (SC-70)
FIGURE 4-2: The addition of R1 at the RESET output of the TCM809 ensures that the RESET output is valid to VDD = 0V.
Reset Comparator Overdrive (mV)
[VTH - VDD] (mv)
FIGURE 4-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25C.
(c) 2005 Microchip Technology Inc.
DS21661D-page 5
TCM809/TCM810
4.3 Controllers and Processors With Bidirectional I/O Pins
Buffer
VDD
Some microcontrollers have bidirectional reset pins. Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 k resistor in series with the output of the TCM809/ TCM810 (Figure 4-3). If there are other components in the system that require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the microcontroller, the buffer should be connected as shown with the solid line.
Buffered RESET To Other System Components
TCM809 4.7 k RESET GND
PICmicro(R) Microcontroller
RESET GND
FIGURE 4-3: Interfacing the TCM809 to a Bidirectional RESET I/O.
DS21661D-page 6
(c) 2005 Microchip Technology Inc.
TCM809/TCM810
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
3-Pin SOT-23B Example:
Customer Specific Information Codes for: TCM8xx =
XXNN
Part Number TCM8xxL TCM8xxM TCM8xxT TCM8xxS TCM8xxR TCM8xxJ TCM8xxZ ENB VNB ENB VNB ENB VNB ENB VNB ENB VNB ENB VNB ENB
TCM809 TCM810 J1 JZ J2 JY J3 JX J4 JV J5 JU J6 JT J7 K1 KZ K2 KY K3 KX K4 KV K5 KU -- KS K6
3-Pin SC-70
Example:
Customer Specific Information Codes for: TCM8xx =
XXN
Top Side
YWW
Bottom Side
Part Number TCM8xxL TCM8xxM TCM8xxT TCM8xxS TCM8xxR ELB VLB ELB VLB ELB VLB ELB VLB ELB VLB ELB VLB ELB VLB
TCM809 TCM810 J1 JZ J2 JY J3 JX J4 JV J5 JU J6 JT J7 JS -- KZ -- KY -- KX -- KV -- KU -- KS -- KT
OR
XXNN
TCM8xxJ TCM8xxZ
Legend: XX...X Y YY WW NNN
e3
*
Customer-specific information* Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2005 Microchip Technology Inc.
DS21661D-page 7
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
E E1 2
B n p
p1
D
1
c A A2
L
A1
Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic B
MIN
INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5
MAX
MIN
.035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0
.044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10
MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5
MAX
1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104
DS21661D-page 8
(c) 2005 Microchip Technology Inc.
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
E E1
B
2
p1 D
3 1
p
a
c
A
A2
b
L
A1
Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom p p1 A A2 A1 E E1 D L c B a b
INCHES MIN 3 .026 BSC. .051 BSC. .031 .031 .000 .071 .045 .071 .004 .003 .006 8 8 MAX
.043 .039 .0004 .094 .053 .089 .016 .010 .016 12 12
MILLIMETERS* MIN MAX 3 0.65 BSC. 1.30 BSC. 0.80 1.10 0.80 1.00 0.00 .010 1.80 2.40 1.15 1.35 1.80 2.25 0.10 0.41 0.08 0.25 0.15 0.40 8 12 8 12
*Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
(c) 2005 Microchip Technology Inc.
DS21661D-page 9
TCM809/TCM810
5.2 Product Tape and Reel Specifications
EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)
Top Cover Tape
FIGURE 5-1:
A0 W
K0
B0 P
TABLE 1:
Case Outline NB LB
CARRIER TAPE/CAVITY DIMENSIONS
Package Type SOT-23 SC-70 3L 3L Carrier Dimensions W mm 8 8 P mm 4 4 A0 mm 3.15 2.4 Cavity Dimensions B0 mm 2.77 2.4 K0 mm 1.22 1.19 Output Quantity Units 3000 3000 Reel Diameter in mm 180 180
FIGURE 5-2:
3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS
Device Marking
User Direction of Feed
Pin 1
W, Width of Carrier Tape
Pin 1
P, Pitch Standard Reel Component Orientation Reverse Reel Component Orientation
DS21661D-page 10
(c) 2005 Microchip Technology Inc.
Device Marking
TCM809/TCM810
APPENDIX A: REVISION HISTORY
Revision D (March 2005)
* Updated 6.0 "Packaging Information" to include old and new packaging examples. * Applied new template and rearranged sections to be consistent with current documentation.
Revision C (April 2004) Revision B (January 2002) Revision A (May 2001)
Initial release of data sheet.
(c) 2005 Microchip Technology Inc.
DS21661D-page 11
TCM809/TCM810
NOTES:
DS21661D-page 12
(c) 2005 Microchip Technology Inc.
TCM809/TCM810
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X X Temperature Range XXXXX Package Examples:
a) TCM809LENB713: SOT-23B-3-TR, Microcontroller 4.63V Reset Monitor, -40C to +85C, Tape and Reel. SC-70-3-TR, Microcontroller 4.63V Reset Monitor, -40C to +125C, Tape and Reel. SOT-23B-3-TR, Microcontroller 4.63V Reset Monitor, -40C to +125C, Tape and Reel. SOT-23B-3-TR, Microcontroller 4.38V Reset Monitor, -40C to +85C, Tape and Reel. SOT-23B-3-TR, Microcontroller 2.63V Reset Monitor, -40C to +125C, Tape and Reel. SC-70-3-TR, Microcontroller 4.38V Reset Monitor, -40C to +125C, Tape and Reel.
VDD
Reset Threshold
Device:
TCM809: Supervisor circuit with active-low RESET output TCM810: Supervisor circuit with active-high RESET output
b)
TCM809LVLB713:
VDD Reset Threshold:
L M J T S R Z
= = = = = = =
4.63V 4.38V 4.00V 3.08V 2.93V 2.63V 2.32V
c)
TCM809LVNB713:
a)
TCM810MENB713:
Temperature Range:
E V
= -40C to +85C = -40C to +125C b) TCM810RVLB713:
Package:
NB713 = SOT-23B, 3-pin (Tape and Reel) LB713 = SC-70, 3-pin (Tape and Reel) c) TCM810TVLB713:
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com) to receive the most current information on our products.
(c) 2005 Microchip Technology Inc.
DS21661D-page 13
TCM809/TCM810
NOTES:
DS21661D-page 14
(c) 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2005 Microchip Technology Inc.
DS21661D-page 15
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
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ASIA/PACIFIC
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EUROPE
Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/01/05
DS21661D-page 16
(c) 2005 Microchip Technology Inc.

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